5 GHz to 70 GHz

Substrate-integrated-waveguide (SIW) horn antennas built on thin substrates (substrate thickness smaller than λ 0/10) are not widely used owing to their low front-to-back ratio and the impedance mismatch between the aperture and the free space. A SIW horn antenna with metalised via holes in front of the aperture is proposed to deal with the issue of impedance mismatch. The metalised via holes introduce shunt inductance between the top and bottom metal planes of the SIW, which increases the impedance of the SIW and improves the impedance matching. Two prototypes working at the Ku band with via holes positioned differently are designed, manufactured and measured. The simulated and measured S- parameters, antenna gain and radiation patterns are presented.

中文翻译：

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SIW 喇叭天线建立在具有改进阻抗匹配的薄基板上

基板集成波导 (SIW) 喇叭天线构建在薄基板（基板厚度小于 λ 0/10）上，由于其前后比低以及孔径与自由空间之间的阻抗不匹配而未得到广泛应用。建议在孔径前带有金属化通孔的 SIW 喇叭天线来解决阻抗不匹配的问题。金属化过孔会在 SIW 的顶部和底部金属平面之间引入分流电感，从而增加 SIW 的阻抗并改善阻抗匹配。

• 5 GHz to 70 GHz Double Ridged Broadband Waveguide Horn Antenna, V-Female Connector (1.85mm)
• EMC/ EMI test Antenna 

设计、制造和测量了两个在 Ku 波段工作的原型，其中通孔位置不同。介绍了模拟和测量的 S 参数、天线增益和辐射方向图。